CEPREI has the strongest national base for reliability physics research and development of related application technologies. Its research areas includes microelectronic and component failure mechanisms and their mathematic models, new failure analysis techniques, accelerated testing and screening techniques, design for reliability and simulation technologies, electronic component (assembly) process quality analysis, reliability growth and reliability evaluation services.

With more than 200 advanced precision devices for performance testing, testing assessment, failure analysis and physical and chemical analysis, and large analysis equipment such as SEM & EDX，C-SAM，X-ray，Metallography Microscope，FT-IR，AAS，InfraScope，IC test instrument，E-beam，Decapsulation system，Reactive Ion Etching System，IVA, CEPREI becomes the failure analysis laboratory with the most advanced equipment and strongest technical capability in China.

·Failure Analysis（FA）
·Destructive Physical Analysis（DPA）
·PCB /PCBA Test & Analysis
·Electronic Process Materials Test & Analysis
·Environment & Reliability Test
·SLSI Reliability Evaluation
·Statistics Process Control（SPC）
·Consultation & Training